We focus where thermal, radiative, and electromagnetic physics decide whether the hardware works. Across three industries, we bring the same first-principles depth to the problems that standard tools and generalist firms struggle with.
Fusion and advanced-energy hardware runs at the limits of materials and physics. Components face extreme heat flux, intense electromagnetic loads, and radiation, and the modeling has to be research-grade to be trusted. This is where our near-field radiative and EM-thermal depth matters most.
Next-generation cells and large-format storage live or die on coupled electrochemical, thermal, and mechanical behavior. The failure modes that matter most, such as separator cracking, thermal runaway, and interface stress, sit exactly at those couplings, where single-physics tools fall short.
As rack densities climb toward the megawatt, cooling has become a core engineering problem. Whether the approach is cold plates, CDUs, or immersion, the performance claims need defensible CFD behind them, validated against real hardware.
Bring us the thermal, radiative, or electromagnetic problem your current tools can't crack, and we'll tell you straight whether we can help.